Download e-book for iPad: Fundamentals of Microsystems Packaging (EPI) by Rao Tummala

By Rao Tummala


Written by means of Rao Tummala, the field’s major writer, basics of Microsystems Packaging is the single publication to hide the sector from wafer to structures, together with each significant contributing expertise. This rigorous and thorough advent to digital packaging applied sciences offers a high-quality grounding in microelectronics, photonics, RF, packaging layout, meeting, reliability, trying out, and production and its relevance to either semiconductors and structures. You’ll find:

*Full insurance of electric, mechanical, chemical, and fabrics elements of every technology

*Easy-to-read schematics and block diagrams

*Fundamental methods to all method issues

*Examples of all universal configurations and technologies—wafer point packaging, unmarried chip, multichip, RF, opto-electronic, microvia forums, thermal and others

*Details on chip-to-board connections, sealing and encapsulation, and production processes

*Basics of electric and reliability testing

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Fundamentals of Microsystems Packaging (EPI) by Rao Tummala

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